Chip Wire Bond Inspection

Chip Wire Bond inspection is a crucial detection process in the semiconductor packaging stage, focusing on the connection quality of bonded wires. By examining the connection status of bonding wires such as gold wires and copper wires, it ensures the stable transmission of internal circuit signals of the chip. Its core inspection objects include bonding points (the connection part between the pad and the wire), the arc height of the wire, and the wire itself, involving components like the chip substrate, bonding wires, and chip die.  

The inspection pain points are prominent: The diameter of bonding wires is only a few micrometers, and defect features such as wire arc height and bonding point deviation are extremely tiny, making manual visual inspection completely incompetent. Traditional vision equipment is easily interfered by the reflection of metal wires and background noise, and lacks sufficient accuracy in identifying hidden defects like wire breakage and cold solder joints. Wit