FPC (Flexible Printed Circuit) is a highly flexible circuit board with excellent conductivity. Due to its lightweight, thin profile, and bendable/foldable properties, it is widely used in 3C products such as mobile phones and wearable devices. It typically consists of components like gold-plated surfaces, flexible substrates, connectors, shielding films, and pads, enabling flexible transmission of circuit signals.
Its cosmetic inspection faces prominent pain points: there are over 60 inspection items, covering various defects such as foreign objects, scratches, copper exposure, and poor cutting, with a mix of common and rare defects; traditional AOI equipment has serious missed detections and struggles to cover complex defect types; manual inspection requires a lot of labor with poor stability, increasing costs and restricting the intelligent upgrading of production lines.
